MILPITAS, Calif., July 20, 2020 / – KLA Corporation (NASDAQ: KLAC) today announced the launch of the revolutionary eSL10™ electron beam patterned wafer defect inspection system. The system’s unique inspection capabilities enable it to detect defects that cannot be captured by conventional optical or other e-beam inspection platforms, accelerating time-to-market for high-performance logic and memory Chips, including those that rely on extreme ultraviolet (EUV) lithography. chip). The research and development of eSL10 starts from the most basic structure, and has developed a number of breakthrough technologies in response to the problems that have existed in research and production for many years. It can provide high-resolution, high-speed detection functions, which is unmatched by any other electron beam system on the market. of.
Amir Azordegan, General Manager of KLA’s Electron Beam Division, said: “Using a single high-energy electron beam, the eSL10 system takes electron beam inspection performance to a new level. Prior to this, electron beam inspection systems could not combine sensitivity and throughput, severely limiting practical applications. Our excellent R&D engineering team has adopted a completely new approach to design electron beam architectures and algorithms, and developed new systems that can solve problems that existing equipment cannot. Currently, KLA includes electron beam inspection in the manufacture of cutting-edge products. Critical equipment list.”
Figure: For advanced logic, DRAM and 3D NAND devices, KLA’s revolutionary eSL10™ e-beam patterned wafer defect inspection system utilizes unique technology to identify critical defects in products.
The eSL10 e-beam inspection system features several revolutionary technologies that bridge the gap in critical defect detection capabilities. The unique electro-optical design provides the industry’s widest operating range, capturing defects in a variety of different process layers and device types. The Yellowstone™ scanning mode can collect 10 billion pixels of information per scan, and supports high-speed operation without compromising resolution, so that potential weaknesses can be efficiently studied in large areas for defect discovery. Simul-6™ sensor technology can simultaneously collect surface, topography, material contrast and deep trench information in a single scan, reducing the time required to identify different defect types in challenging device structures and materials. With its advanced artificial intelligence (AI) system, the eSL10 utilizes deep learning algorithms to meet the evolving inspection requirements of IC manufacturers, eliminating the defects most critical to device performance.
Three-dimensional device structures, such as 3D NAND and DRAM for memory applications, and FinFET and GAA (Gate-All-Around) structures for logic devices, require fabs to rethink traditional defect control strategies. The combination of the eSL10 with KLA’s flagship 39xx (“Gen5”) and 29xx (“Gen4”) broad-spectrum wafer defect inspection systems provides a powerful defect discovery and monitoring solution for advanced IC technologies. Working together, these systems improve product yield and reliability, will find critical defects faster, and enable faster defect resolution from R&D to production.
The new eSL10 system platform is uniquely scalable and can be extended to the entire e-beam inspection and metrology application. Advanced logic device, memory and process equipment manufacturers around the world use the eSL10 system to help R&D production processes, and to enhance and monitor next-generation product processes and device manufacturing. To maintain its high performance and productivity performance, the eSL10 system is backed by KLA’s comprehensive global service network. Additional information on the new e-beam defect inspection system can be found on the eSL10 product page.
About KLA:
KLA Corporation develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and support solutions for the manufacture of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. By working closely with the world’s leading customers, we bring together our talented team of physicists, engineers, data scientists and problem solvers to create and develop solutions that move the world’s technology forward. For more information, visit kla.com (KLAC-P).
Forward-Looking Statements:
Statements in this press release, other than historical facts, are forward-looking statements, such as statements regarding the expected performance of the eSL10, 29xx and 39xx systems and the economic impact of reducing defects in wafers, equipment, materials and chip fabrication facilities, subject to Forward-Looking Statement Disclaimer under the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on current information and expectations and involve risks and uncertainties. Actual results may differ materially from those anticipated in such statements due to various factors, including delays in adopting new technologies (whether due to cost or performance issues or otherwise), the introduction of competing products by other companies or unexpected technical challenges or limitations in and out. could affect the implementation, performance or use of KLA products.
MILPITAS, Calif., July 20, 2020 / – KLA Corporation (NASDAQ: KLAC) today announced the launch of the revolutionary eSL10™ electron beam patterned wafer defect inspection system. The system’s unique inspection capabilities enable it to detect defects that cannot be captured by conventional optical or other e-beam inspection platforms, accelerating time-to-market for high-performance logic and memory chips, including those that rely on extreme ultraviolet (EUV) lithography. chip). The research and development of eSL10 starts from the most basic structure, and has developed a number of breakthrough technologies in response to the problems that have existed in research and production for many years. It can provide high-resolution, high-speed detection functions, which is unmatched by any other electron beam system on the market. of.
Amir Azordegan, General Manager of KLA’s Electron Beam Division, said: “Using a single high-energy electron beam, the eSL10 system takes electron beam inspection performance to a new level. Prior to this, electron beam inspection systems could not combine sensitivity and throughput, severely limiting practical applications. Our excellent R&D engineering team has adopted a completely new approach to design electron beam architectures and algorithms, and developed new systems that can solve problems that existing equipment cannot. Currently, KLA includes electron beam inspection in the manufacture of cutting-edge products. Critical equipment list.”
Figure: For advanced logic, DRAM and 3D NAND devices, KLA’s revolutionary eSL10™ e-beam patterned wafer defect inspection system utilizes unique technology to identify critical defects in products.
The eSL10 e-beam inspection system features several revolutionary technologies that bridge the gap in critical defect detection capabilities. The unique electro-optical design provides the industry’s widest operating range, capturing defects in a variety of different process layers and device types. The Yellowstone™ scanning mode can collect 10 billion pixels of information per scan, and supports high-speed operation without compromising resolution, so that potential weaknesses can be efficiently studied in large areas for defect discovery. Simul-6™ sensor technology can simultaneously collect surface, topography, material contrast and deep trench information in a single scan, reducing the time required to identify different defect types in challenging device structures and materials. With its advanced artificial intelligence (AI) system, the eSL10 utilizes deep learning algorithms to meet the evolving inspection requirements of IC manufacturers, eliminating the defects most critical to device performance.
Three-dimensional device structures, such as 3D NAND and DRAM for memory applications, and FinFET and GAA (Gate-All-Around) structures for logic devices, require fabs to rethink traditional defect control strategies. The combination of the eSL10 with KLA’s flagship 39xx (“Gen5”) and 29xx (“Gen4”) broad-spectrum wafer defect inspection systems provides a powerful defect discovery and monitoring solution for advanced IC technologies. Working together, these systems improve product yield and reliability, will find critical defects faster, and enable faster defect resolution from R&D to production.
The new eSL10 system platform is uniquely scalable and can be extended to the entire e-beam inspection and metrology application. Advanced logic device, memory and process equipment manufacturers around the world use the eSL10 system to help R&D production processes, and to enhance and monitor next-generation product processes and device manufacturing. To maintain its high performance and productivity performance, the eSL10 system is backed by KLA’s comprehensive global service network. Additional information on the new e-beam defect inspection system can be found on the eSL10 product page.
About KLA:
KLA Corporation develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and support solutions for the manufacture of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. By working closely with the world’s leading customers, we bring together our talented team of physicists, engineers, data scientists and problem solvers to create and develop solutions that move the world’s technology forward. For more information, visit kla.com (KLAC-P).
Forward-Looking Statements:
Statements in this press release, other than historical facts, are forward-looking statements, such as statements regarding the expected performance of the eSL10, 29xx and 39xx systems and the economic impact of reducing defects in wafers, equipment, materials and chip fabrication facilities, subject to Forward-Looking Statement Disclaimer under the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on current information and expectations and involve risks and uncertainties. Actual results may differ materially from those anticipated in such statements due to various factors, including delays in adopting new technologies (whether due to cost or performance issues or otherwise), the introduction of competing products by other companies or unexpected technical challenges or limitations in and out. could affect the implementation, performance or use of KLA products.
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