1
introduction
semiconductor components refer to components that meet semiconductor equipment and technical requirements in terms of material, structure, process, quality and precision, reliability and stability, such as O-Ring seals, EFEM (transmission module), RF Gen RF power supply, ESC electrostatic chuck, Si silicon ring and other structural parts, Pump vacuum pump, MFC gas flow meter, precision bearing, ShowerHead gas shower head, etc. Semiconductor equipment is composed of thousands of components. The performance, quality and precision of components directly determine the reliability and stability of the equipment, and are also the key basic elements for my country’s semiconductor manufacturing capability to leap to high-end. The domestic semiconductor parts industry started late, the overall level of my country’s semiconductor parts industry is low, the supply capacity of high-end products is insufficient, and the problems of poor product reliability, stability and consistency are increasingly prominent. In the context of the increasingly complex global macro-political economy and the continuous suppression of the strategic rise of my country’s high-tech industry by the United States, the phenomenon of the industry being “stuck in the neck” is more prominent. The digital economy, people’s livelihood economy and national defense security also bring risks that cannot be underestimated.
2
Main classification and main characteristics of semiconductor components
(1) Main classification of semiconductor components
Semiconductor components are the key components of semiconductor equipment. According to incomplete statistics, there is currently no standard for the classification of semiconductor components in the industry. At present, there are mainly the following classification methods.
According to the internal process of the typical integrated circuit equipment cavity, the components can be divided into five categories: power supply and radio frequency control, gas delivery, vacuum control, temperature control, and conveying device. The power supply and RF control categories include RF generators and matchers, DC/AC power supplies, etc. Gas transportation mainly includes flow controllers, pneumatic components, gas filters, etc. The vacuum control category includes various vacuum pumps such as dry pump/cold pump/molecular pump, various valves such as control valve/pendulum valve, pressure gauge and O-Ring sealing ring. The temperature control category includes heating plates/electrostatic chucks, heat exchangers and lifting components. Conveyor devices include robotic arms, EFEM, bearings, precision rails, stepper motors, etc.
According to the main materials and functions of semiconductor parts, they can be divided into twelve categories, including silicon/silicon carbide parts, quartz parts, ceramic parts, metal parts, graphite parts, plastic parts, vacuum parts, sealing parts , filter parts, moving parts, Electronic control parts and other parts. The major types of parts also include several subdivision products, such as vacuum gauges (measurement of process vacuum), vacuum pressure gauges, gas flow meters (MFC), vacuum valves, vacuum pumps and other key components .
According to the service objects of semiconductor components, the core components of semiconductors can be divided into two types, namely precision machining parts and general outsourcing parts[1]. Precision machining parts are usually designed by engineers of various semiconductor equipment companies, and then outsourced for processing. They will only be used in their own company’s equipment, such as process chambers, transfer chambers, etc. Localization is relatively easy, and their surface treatment is generally performed. , precision machining and other technological requirements are higher; general outsourcing parts are some general-purpose parts that have been verified for a long time and have been widely recognized by many equipment factories and manufacturers. They are more standardized and will be used by different equipment companies. It will also be used as spare parts consumables on the production line, such as silicon structural parts, O-Ring seals, valves, gauges, pumps, Face plates, gas shower heads, etc. Strong versatility and consistency, and need to be certified on equipment and manufacturing lines, so localization is difficult.
Table 1-1 summarizes the major component products that are widely used in equipment and production lines and the semiconductor equipment that they mainly serve.
Table 1-1. Semiconductor equipment of major component products and their major services
(Data source: network information collation)
(2) Main features of the semiconductor components industry
The semiconductor component industry usually has the characteristics of high technology-intensity, interdisciplinary integration, small and scattered market size, but it plays a pivotal role in the value chain. Generally speaking, equipment parts account for about 70% of the total equipment expenditure. Taking the etching machine as an example, ten major key components account for 85% of the total equipment cost. It is the key support for the survival and development of the semiconductor industry, and its level directly determines the basic energy level of my country’s innovation in the semiconductor industry.
a. Technology-intensive, requiring high precision and reliability.
Compared with the basic components in other industries, semiconductor components are used for precision semiconductor manufacturing, and their cutting-edge technology-intensive characteristics are particularly obvious, with high precision, small batches, multiple varieties, special dimensions, complex processes, and extremely demanding requirements. Features. Due to the particularity of semiconductor components, enterprise production often takes into account composite functional requirements such as strength, strain, corrosion resistance, electronic properties, electromagnetic properties, and material purity. The same part, if it is feasible to use in traditional industries, but used in the semiconductor industry, the purity of raw materials, the consistency of raw material batches, quality stability, machining accuracy control, edge chamfering and deburring of key components , surface roughness control, special surface treatment, clean cleaning, vacuum and dust-free packaging, delivery cycle and other aspects have higher requirements, resulting in a very high technical threshold. For example, as the line width of semiconductor processing is getting smaller and smaller, the control of extremely small pollutants in the lithography process is extremely strict, not only the strict control of particles, but also the precipitation of metal ions in filter products, which is very important for the production and manufacture of filter parts for semiconductors. put forward extremely high demands. At present, the accuracy of semiconductor-grade filter elements is required to reach 1 nanometer or even below, while in other industries, the accuracy is required to be in the micron level. At the same time, filters for semiconductors also need to ensure consistency, as well as chemical and heat resistance, strong resistance to shedding, etc., so as to achieve repeatable high performance, consistent quality and ultra-pure product cleanliness required in semiconductor manufacturing. Equally high requirements.
b. Multi-disciplinary cross-integration, high requirements for compound technical talents.
There are many types of semiconductor parts, covering a wide range and a long industrial chain. Its R&D, design, manufacturing and application involve the cross-discipline and multi-disciplinary integration of materials, machinery, physics, electronics, and precision instruments. Great demand. Taking the electrostatic chuck used to fix the wafer in semiconductor manufacturing as an example, it uses alumina ceramics or aluminum nitride ceramics as the main material, but at the same time, other conductive substances need to be added to make its overall resistivity meet the functional requirements. It is necessary to have a good understanding of the thermal conductivity, wear resistance and hardness of the ceramic material in order to obtain the basic raw materials that meet the technical indicators of semiconductor manufacturing; secondly, the internal machining structure of the ceramic requires high precision, and the combination of the ceramic layer and the metal base must meet the uniformity and High-strength requirements, so the structural design and processing of the electrostatic chuck requires skills and knowledge in precision machining; and the surface of the electrostatic chuck should reach a coating of about 0.01 microns after surface treatment, and at the same time, it must be resistant to high temperature, wear resistance and service life. More than three years, therefore, the requirements for the mastery and application of surface treatment technology are also relatively high. It can be seen that compound and cross-type technical talents are the basic guarantee for the semiconductor components industry.
c. The characteristics of fragmentation are obvious, and the international leading enterprises mainly focus on cross-industry and multi-product line development and M&A strategies.
Compared with the semiconductor equipment market, the semiconductor parts market is more subdivided, with obvious fragmentation characteristics. The market space for a single product is very small, and the technical threshold is high, so there are few pure semiconductor parts companies. Internationally leading semiconductor component companies usually focus on the development strategy of cross-industry and multi-product lines, and semiconductor components are often only one of the businesses of these large component manufacturers. For example, MKS Instrument Company occupies a major market share in product lines such as gas pressure gauges/reactors, RF/DC power supplies, vacuum products, and robotic arms. In addition to applications in the semiconductor industry, it is also widely used in industrial manufacturing, life and health sciences and other fields. Continuous mergers and acquisitions and integrations are also the main means used by the world’s leading semiconductor components companies to expand their scale. Following the acquisition of Edwards in 2014, it acquired another leader in the field of vacuum technology, German leybold (Leybold) in 2016, and established a separate vacuum technology department in 2017. In July 2019, Atlas acquired Brooks again (Brooks). ), the acquisition includes the cryopump operating company and Brooks’ 50% stake in Ulvac Cryogenics Ltd., further enhancing the global competitiveness of its vacuum business in the semiconductor field.
3
Semiconductor components market size and development pattern
(1) Scale and pattern of global semiconductor components market
The global semiconductor parts market mainly consists of two parts according to different service objects. One is the parts and related services custom-made or purchased by global semiconductor equipment manufacturers. According to data provided by VLSI, the sales volume of the subsystem market of semiconductor equipment in 2020 is close to US$10 billion, of which maintenance + support services account for 46%, component product sales account for 32% and replacement + upgrades account for 22%. The second is the parts and related services directly procured by global semiconductor manufacturers as consumables or spare parts.According to core data[2], In 2020, the purchase amount of front-end equipment parts for 8-inch and 12-inch wafer lines in mainland China exceeded 1 billion US dollars. my country’s manufacturing capacity accounts for about 12-15% of the world’s total. Considering the high value-added parts procurement demand brought by advanced technology, the global procurement of front-end equipment parts for 8-inch and 12-inch wafer lines is at least US$10 billion above. Therefore, by superimposing two parts of the semiconductor parts sales market, it can be seen that the global semiconductor parts market is 20 billion to 25 billion US dollars or even larger.
Although the overall size of the semiconductor component market is only less than 5% of the global semiconductor market size of nearly 500 billion US dollars, the value of components is usually dozens of times their own prices, and they have strong industrial radiation capabilities and influence. In addition, the key technology of semiconductor components reflects the technological level of a country’s industry and semiconductor equipment, and has a very important strategic position. Its technological progress is a prerequisite for technological innovation affecting the downstream digital economy and information application industries.
According to VLSI data[3]among the top 10 leading suppliers of semiconductor components in the world in 2020 (see Table 2-1), including Zeiss ZEISS (optical lens), MKS instruments (MFC, RF power supply, vacuum products), Edwards (vacuum pump), Advanced Energy (RF power supply), Horiba (MFC), VAT (Vacuum Valves), Ichor (Modular Gas Delivery System and other components), Ultra Clean Tech (Sealing System), ASML (Optics) and EBARA (Dry Pumps).
Table 2-1. Ranking of the top ten semiconductor component manufacturers in the world
(Data sources: annual reports of each company, collation of network information)
According to the VLSI data in Figure 2-1, in the past 10 years, the total market share of the top ten suppliers has tended to stabilize at around 50%. However, due to the strict requirements on precision and quality of semiconductor components, as far as a single semiconductor component is concerned, there are only a few suppliers in the world that can provide products, which also leads to the fact that although the industry concentration of semiconductor components is only 50% However, the concentration of sub-categories is often above 80%-90%, and the monopoly effect is relatively obvious. For example, in the field of electrostatic chucks, American and Japanese semiconductor companies are basically dominated (see Table 2-2), with a market share of more than 95%, mainly including American AMAT (Applied Materials), American LAM (Fanlin Group), and Japanese company Shinko (Shinko Electric), TOTO, NTK, etc.
Figure 2-1. The market share of the world’s top ten semiconductor component manufacturers is stable at around 50% (Data source: VLSI)
Table 2-2. List of global leading companies of major parts and components
(Data source: Jiangfeng Electronics, network information collation)
(2) Scale and pattern of my country’s semiconductor components market
At present, my country’s semiconductor parts industry is still in its infancy, and the overall scale is small.According to core data[2], In 2020, China’s local wafer manufacturers (mainly including SMIC, Hua Hong Group, China Resources Microelectronics, Yangtze River Storage, etc.) purchased 8-inch and 12-inch front-end equipment parts for about US$430 million. However, due to the rapid expansion of domestic wafer manufacturing capacity in my country, it is expected that the demand for semiconductor components will continue to be strong. According to the existing domestic wafer manufacturing capacity plan, there will be 50% new capacity by 2023. According to the purchase demand of equipment and production lines at the same time, it is estimated that the domestic semiconductor components market will exceed 8 billion yuan in 2023, and is expected to exceed 12 billion yuan by 2025.
Despite the rapid growth of the domestic semiconductor component market, the technical capabilities, process levels, product accuracy and reliability of my country’s local component companies are far from meeting the needs of domestic equipment and wafer manufacturers, and the overall localization rate is still relatively high. low level. Generally speaking, for precision machined parts produced by customized design, the localization rate in my country is relatively high. Because domestic semiconductor equipment is in its infancy, in order to achieve mass production as soon as possible to catch up with the advanced level, it often adopts the model of self-designed, and then processed by foreign (mainly Japan, a small amount of South Korea) processors. Due to the special requirements of raw materials, processing methods, surface treatment methods and cleaning and packaging for precision machining parts of semiconductor equipment, domestic processors could not meet them for a while, and also because Japanese processing technology suppliers have relatively rich experience in processing parts of the same type. Some design mistakes can be found and adjusted during processing. Later, with the gradual expansion of the domestic market, a small number of domestic semiconductor equipment manufacturers, in order to reduce costs and ensure the security of the supply chain, began to gradually cultivate domestic processors from other industries and began to devote themselves to the processing of precision parts of semiconductor equipment. Therefore, in the field of precision machining parts dominated by equipment manufacturers, domestic parts manufacturers have made rapid progress. However, for general-purpose purchased parts that are more standardized and highly dependent on market competition, the localization rate is generally very low. The main reason is that the design and production requirements of these general-purpose purchased parts are very high. Even if the samples of domestic products can reach the same level, they still need to work hard to ensure the stability of mass production.At the same time, because domestic equipment companies have just made progress in localization, they are still relatively passive in the procurement of general-purpose components, mainly domestic mature products, and are reluctant to try new domestically manufactured products.[1].
The above are the main reasons why my country is still unable to achieve “self-controllable” in the core products of semiconductor components. According to the data of domestic mainstream foundries, there are more than 2,000 types of parts (including maintenance replacement and failure replacement parts) used in daily operations throughout the year, but the domestic market share is only about 8%. The US and Japan share 59.7% and 26.7% respectively. In fact, the high-end parts market is mainly occupied by suppliers from the United States, Japan and Europe; the mid- and low-end parts market is mainly occupied by suppliers from South Korea and Taiwan. The electrostatic chuck is a key non-consumable component of a wafer manufacturing plant, and the unit price is as high as tens of thousands or even hundreds of thousands of dollars. At present, there is no domestic company that can make relevant mature products, even the aluminum nitride ceramic raw materials used in electrostatic chucks. Far from meeting the required technical indicators, the external dependence is over 99%. In addition, although the scale of my country’s vacuum pump industry has approached 200 billion yuan, high-end products from Edwards and other companies still need to be imported in terms of semiconductor dry vacuum pumps. However, in recent years, with the acceleration of new production capacity and expansion of the domestic semiconductor industry, the superposition of the new crown epidemic has caused the obstruction of logistics and transportation services, resulting in continuous delays in the delivery of foreign parts and components, which has brought accelerated progress to some domestic semiconductor parts companies with high growth potential in China Opportunities for domestic substitution. For example, the ShowerHead and cavity processing business of Jiangfeng Electronics, the filter business of Cobaite, and the dry vacuum pump business of Tongjia Hongrui. Table 2-3 summarizes some Chinese companies in different semiconductor components fields.
Table 2-3. Major domestic semiconductor parts companies
(Data source: network information collation)
4
The main problems faced by the localization of semiconductor components
(1) Lack of attention to parts and components, and industrial support policies are out of place
The total scale of the semiconductor component industry is in the billions. Compared with the core semiconductor industry chain, the volume is small, the product variety and specifications are various, the number of leading enterprises is small, the industrial concentration is low, and the existing technical problems are scattered. Therefore, for a long time not getting enough attention.Since 2014, my country has promoted the development of the semiconductor industry to a national strategy, and subsequently at least 30 local governments have issued support policies to promote the development of the semiconductor industry.[9]However, whether at the national level or at the local level, policies focus more on design, manufacturing, packaging and testing, equipment and materials, and rarely cover the semiconductor component industry. In terms of capital, parts and components companies rarely get the favor of capital. The National Integrated Circuit Industry Investment Fund currently invests a relatively small proportion in the field of semiconductor components, and the investment amount is less than 100 million yuan. By the end of 2020, the total market value (less than 30 billion yuan) of listed companies with semiconductor components as their main business accounted for only 1% of the total market value of all semiconductor industry chain companies (more than 3 trillion yuan).
(2) The innovation capability is relatively backward, and the core technology gap is obvious
Because the parts industry has not received attention for a long time, it can only grow extensively. Therefore, most domestic parts companies enter the semiconductor industry mainly to provide maintenance and replacement services and cleaning services. The overall R&D investment is not enough, and the innovation ability is relatively backward. For a long time staying at the low-end production standard and copying the level of foreign products, the core technology gap is obvious. According to the prospectus of a domestic semiconductor component listed company, there are only 15 R&D personnel, and the total R&D investment from 2016 to 2018 is less than 20 million yuan, and the average annual R&D investment intensity is less than 5%. In addition, the lack of innovation capability of my country’s semiconductor parts industry is also reflected in the imperfect industry standard system, serious lack of investment in basic process research, poor access to process technology, and the lack of close integration of scientific research and production practice, which restricts semiconductor parts products. Innovative development of structural design technology, reliability technology, manufacturing process and process, and basic material performance research.
Table 2-4. Technical difficulties of major domestic semiconductor components
(Data source: SMIC[4]Jiangfeng Electronics[6]network information organization)
(3) Insufficient supply of craftsman talents and lack of effective incentive mechanism
At present, the talent gap in my country’s semiconductor industry has reached hundreds of thousands of people. Although my country has introduced a series of support measures in semiconductor talent training in recent years, a large number of semiconductor talent training mainly focuses on design, manufacturing, equipment and materials. There is still a lack of attention to talent training in basic industries such as basic disciplines. There is a lack of overall planning and implementation in the education system reform of basic disciplines, professional setting, on-the-job engineering education, and technical qualification certification. There is also a lack of guidance for the craftsman spirit who advocates refinement, truth-seeking, innovation, and is proficient in design and tackling tough problems.[5]. In addition, the semiconductor components industry faces serious problems of insufficient talent incentive mechanism. Although the overall salary level of personnel in the domestic semiconductor industry has been greatly improved compared with before, for the machining, precision instrumentation, surface treatment and other industries required by component companies, the salary of employees is generally much lower than the average level of the semiconductor industry. According to the prospectus of a domestic semiconductor component company, there were only 15 R&D personnel before its listing, the annual salary of core technicians was only 75,000, and the annual salary of ordinary R&D personnel was only 30,000. The low salary level has led to a serious brain drain in semiconductor parts companies, resulting in a lack of successors in the basic parts industry and falling into a vicious circle.
(4) The links of the industrial chain are out of touch, and the upstream support capacity is insufficient
Before semiconductor components are verified on large-scale production lines and sold on a large scale, they need to go through strict and complex verification procedures. Therefore, component manufacturers need to have full cooperation with downstream equipment and manufacturers. At present, the domestic semiconductor component online verification process is complicated and the process is long. The cooperation between manufacturers, equipment manufacturers and domestic semiconductor component manufacturers is not high, and there is a lack of effective communication and interaction. Domestic substitution power is insufficient. In addition, in the long-term product iteration process, existing foreign component manufacturers have formed a large number of Know-How (technical know-how).However, in the follow-up imitation and trial production process, domestic manufacturers can only be similar in shape. Due to lack of experience and key technologies, they are eliminated in the initial verification and cannot enter large-scale applications.[5]. In addition, domestic semiconductor component manufacturers cannot obtain support from supporting links such as raw materials and production equipment, which also affects the competitiveness of their products. Semiconductor components are generally products with various varieties and high processing precision requirements. The raw materials and processing equipment for producing these components are demanding and expensive. As my country’s industry is influenced by the long-standing idea of ”focusing on the main engine and ignoring the supporting equipment”, the investment in the upstream and downstream supporting fields of parts and components is seriously insufficient, resulting in a gap between my country and foreign countries in the raw materials and production equipment of parts and components. For example, for the high-precision machining centers commonly used in semiconductor metal parts, my country lags behind foreign countries in terms of machining accuracy, machining stability, and geometric flexibility. Another example is aluminum alloy metal, tungsten and molybdenum metal, the raw materials for high-end metal parts manufacturing, and high-purity quartz sand raw materials for the upstream raw materials of quartz parts, which are basically monopolized by American and Japanese companies. limited to passive. Mainstream quartz glass materials (tube/rod/silo) basically come from companies in the United States, Germany, and Japan. The lack of upstream processing equipment and raw materials has led to the fact that most of my country’s semiconductor parts companies have been operating at a low-tech level for a long time. The level of raw materials and process equipment is not high, and the advanced equipment is lacking and not supporting. It cannot guarantee the consistency of product quality, affecting the Product quality improvement.
(5) Some manufacturing conditions are limited, which affects the upgrade to high-end
Since the semiconductor manufacturing process is often in a high temperature and highly corrosive environment, more than half of the semiconductor components need to be surface treated to improve their corrosion resistance. For example, the plasma etching chamber of semiconductor etching equipment is in a high-density, high-corrosion, high-activity plasma environment, and the chamber and its components are easily corroded by plasma. In order to prolong the service life of these components, it is often used in Anodizing the surface of aluminum-based materials (aluminum and aluminum alloys) can effectively reduce the corrosion of the chamber and other aluminum-based materials by plasma. The increasingly strict environmental protection requirements in my country have led to the controlled development of most surface treatment technologies such as sandblasting, thermal spraying, electroplating, and anodizing, which has led to some high-end surface treatment processes, such as micro-arc oxidation, high-end spraying, and Y2O3 ceramic coating. There is always a big gap in China, which also directly affects the performance and quality of parts and components. Valve parts, gas sprinkler head Showerhead, ceramic parts Ceramic and other parts, although Chinese manufacturers can make shapes according to the drawings, but because they cannot solve Material and surface treatment issues, development is constrained by the foundation.In addition, some cutting-edge technologies of semiconductor components are limited by the “embargo”. Domestic companies lack drawings and precision data, so they cannot evolve to mid-to-high-end technologies. For example, the low-voltage vacuum gauges produced by MKS in the United States have always required Apply for an export license to purchase[6].
5
Suggestions on the Development of Semiconductor Parts Industry in my country
(1) Attach importance to top-level design and guide industry development
The field of semiconductor components is a key “stuck neck” link that has long relied heavily on advanced countries such as the United States and Japan, and needs to pay more attention to top-level design. It is recommended to formulate a special plan, plan or roadmap for the development of the semiconductor components industry, determine the long-term strategic framework for the development of the industry, and formulate appropriate policies and plans according to the development status at home and abroad in different periods to guide the development of the industry in an orderly manner. In particular, market capitalization attaches great importance to the semiconductor components industry.
(2) Set up industry special projects to stimulate innovation vitality
To achieve the rapid development and prosperity of the semiconductor parts industry, the most fundamental thing is to enhance the ability of independent innovation. At present, my country’s only imitation and tracking technology in the field of semiconductor parts has been unable to achieve a comprehensive guarantee of the semiconductor supply chain. Only Only through independent innovation can transcendence be achieved.Although some parts and components companies have been supported in the 02 special project[7], but it still needs to be further strengthened. It is recommended to set up a separate special project for the semiconductor parts industry in the national science and technology plan, and to unite with domestic leading enterprises of semiconductor parts, prepare to build a national-level parts technology innovation platform or research institute, gather superior forces to aim at breakthroughs and main directions of attack, adhere to independent innovation and research and development, and focus on Conquer a number of key core technologies of industrial basic parts, establish a technological innovation system with enterprises as the main body and a combination of production, education, and research, and guide the research and development of cutting-edge technologies, basic technologies, and key common technologies in the field of semiconductor components at the national level.
(3) Make up the policy gap and strengthen investment guidance
The semiconductor component industry is an industry with full market competition. The domestic component enterprises are small in scale, large in number, and thin in product profits. The research and development investment of new products and new technologies cannot be compared with that of international large enterprises, and it is difficult to win simply by market competition. However, under the current international geopolitical background, the government needs to implement relevant special policies to guide and support, and help domestic semiconductor parts companies to grow rapidly. It is suggested that the major products independently developed by domestic semiconductor parts companies should be subsidized and supported by the national finance and local finance, strengthen the protection of intellectual property rights of self-designed products, and include semiconductor parts and components in the government’s first set of procurement catalogs. Encourage various domestic industrial funds and socialized capital to actively invest in semiconductor parts companies, and help domestic semiconductor parts companies to develop through the capital market.
(4) Increase talent introduction and training and strengthen talent supply
Comprehensively strengthen the training and introduction of engineering, scientific research, and compound talents in the fields of semiconductor components[8]. Encourage large-scale scientific research institutions to establish postgraduate education and post-doctoral workstations in the direction of semiconductor components, and rely on major national engineering projects and major scientific and technological projects to cultivate leading talents in semiconductor component engineering technology. Advocate enterprises, schools and scientific research institutions to jointly carry out vocational education and on-the-job training, and actively promote the model of school-enterprise cooperation to jointly cultivate skilled talents. Parts of skilled personnel, strengthen the supply of talents. Adopt various methods to actively introduce overseas engineering and technology leaders and talents in short supply, encourage local governments to issue talent policies for core technical backbones and leading entrepreneurs in the field of semiconductor components, and continuously improve the talent incentive mechanism to stimulate the vitality of industrial development.
(5) Promote the linkage of mechanical parts to ensure independent supply
Promote the “mechanical linkage” of the basic semiconductor supply chain, completely reverse the disconnection between parts and components, equipment and manufacturing, and encourage domestic fabs and equipment factories to effectively play the role of large-scale production line organization and coordination through government guidance to collaborate with local parts and components Manufacturers strengthen the cooperation of the industrial chain through various methods such as unveiling the list, horse racing, and targeted research to achieve the coordinated development of the host and basic components. Support semiconductor manufacturing or equipment engineering projects led by the state or local governments, give priority to domestic semiconductor component product verification opportunities, and give certain risk subsidies. Encourage equipment component manufacturers in the fields of machinery, electronics, and chemical industry to actively expand and expand their semiconductor business, develop higher-end products to meet the needs of semiconductor equipment based on their own technical foundation, further consolidate and improve product layout, and enhance the independence of domestic components Supply capacity.
1
introduction
semiconductor components refer to components that meet semiconductor equipment and technical requirements in terms of material, structure, process, quality and precision, reliability and stability, such as O-Ring seals, EFEM (transmission module), RF Gen RF power supply, ESC electrostatic chuck, Si silicon ring and other structural parts, Pump vacuum pump, MFC gas flow meter, precision bearing, ShowerHead gas shower head, etc. Semiconductor equipment is composed of thousands of components. The performance, quality and precision of components directly determine the reliability and stability of the equipment, and are also the key basic elements for my country’s semiconductor manufacturing capability to leap to high-end. The domestic semiconductor parts industry started late, the overall level of my country’s semiconductor parts industry is low, the supply capacity of high-end products is insufficient, and the problems of poor product reliability, stability and consistency are increasingly prominent. In the context of the increasingly complex global macro-political economy and the continuous suppression of the strategic rise of my country’s high-tech industry by the United States, the phenomenon of the industry being “stuck in the neck” is more prominent. The digital economy, people’s livelihood economy and national defense security also bring risks that cannot be underestimated.
2
Main classification and main characteristics of semiconductor components
(1) Main classification of semiconductor components
Semiconductor components are the key components of semiconductor equipment. According to incomplete statistics, there is currently no standard for the classification of semiconductor components in the industry. At present, there are mainly the following classification methods.
According to the internal process of the typical integrated circuit equipment cavity, the components can be divided into five categories: power supply and radio frequency control, gas delivery, vacuum control, temperature control, and conveying device. The power supply and RF control categories include RF generators and matchers, DC/AC power supplies, etc. Gas transportation mainly includes flow controllers, pneumatic components, gas filters, etc. The vacuum control category includes various vacuum pumps such as dry pump/cold pump/molecular pump, various valves such as control valve/pendulum valve, pressure gauge and O-Ring sealing ring. The temperature control category includes heating plates/electrostatic chucks, heat exchangers and lifting components. Conveyor devices include robotic arms, EFEM, bearings, precision rails, stepper motors, etc.
According to the main materials and functions of semiconductor parts, they can be divided into twelve categories, including silicon/silicon carbide parts, quartz parts, ceramic parts, metal parts, graphite parts, plastic parts, vacuum parts, sealing parts , filter parts, moving parts, Electronic control parts and other parts. The major types of parts also include several subdivision products, such as vacuum gauges (measurement of process vacuum), vacuum pressure gauges, gas flow meters (MFC), vacuum valves, vacuum pumps and other key components .
According to the service objects of semiconductor components, the core components of semiconductors can be divided into two types, namely precision machining parts and general outsourcing parts[1]. Precision machining parts are usually designed by engineers of various semiconductor equipment companies, and then outsourced for processing. They will only be used in their own company’s equipment, such as process chambers, transfer chambers, etc. Localization is relatively easy, and their surface treatment is generally performed. , precision machining and other technological requirements are higher; general outsourcing parts are some general-purpose parts that have been verified for a long time and have been widely recognized by many equipment factories and manufacturers. They are more standardized and will be used by different equipment companies. It will also be used as spare parts consumables on the production line, such as silicon structural parts, O-Ring seals, valves, gauges, pumps, Face plates, gas shower heads, etc. Strong versatility and consistency, and need to be certified on equipment and manufacturing lines, so localization is difficult.
Table 1-1 summarizes the major component products that are widely used in equipment and production lines and the semiconductor equipment that they mainly serve.
Table 1-1. Semiconductor equipment of major component products and their major services
(Data source: network information collation)
(2) Main features of the semiconductor components industry
The semiconductor component industry usually has the characteristics of high technology-intensity, interdisciplinary integration, small and scattered market size, but it plays a pivotal role in the value chain. Generally speaking, equipment parts account for about 70% of the total equipment expenditure. Taking the etching machine as an example, ten major key components account for 85% of the total equipment cost. It is the key support for the survival and development of the semiconductor industry, and its level directly determines the basic energy level of my country’s innovation in the semiconductor industry.
a. Technology-intensive, requiring high precision and reliability.
Compared with the basic components in other industries, semiconductor components are used for precision semiconductor manufacturing, and their cutting-edge technology-intensive characteristics are particularly obvious, with high precision, small batches, multiple varieties, special dimensions, complex processes, and extremely demanding requirements. Features. Due to the particularity of semiconductor components, enterprise production often takes into account composite functional requirements such as strength, strain, corrosion resistance, electronic properties, electromagnetic properties, and material purity. The same part, if it is feasible to use in traditional industries, but used in the semiconductor industry, the purity of raw materials, the consistency of raw material batches, quality stability, machining accuracy control, edge chamfering and deburring of key components , surface roughness control, special surface treatment, clean cleaning, vacuum and dust-free packaging, delivery cycle and other aspects have higher requirements, resulting in a very high technical threshold. For example, as the line width of semiconductor processing is getting smaller and smaller, the control of extremely small pollutants in the lithography process is extremely strict, not only the strict control of particles, but also the precipitation of metal ions in filter products, which is very important for the production and manufacture of filter parts for semiconductors. put forward extremely high demands. At present, the accuracy of semiconductor-grade filter elements is required to reach 1 nanometer or even below, while in other industries, the accuracy is required to be in the micron level. At the same time, filters for semiconductors also need to ensure consistency, as well as chemical and heat resistance, strong resistance to shedding, etc., so as to achieve repeatable high performance, consistent quality and ultra-pure product cleanliness required in semiconductor manufacturing. Equally high requirements.
b. Multi-disciplinary cross-integration, high requirements for compound technical talents.
There are many types of semiconductor parts, covering a wide range and a long industrial chain. Its R&D, design, manufacturing and application involve the cross-discipline and multi-disciplinary integration of materials, machinery, physics, electronics, and precision instruments. Great demand. Taking the electrostatic chuck used to fix the wafer in semiconductor manufacturing as an example, it uses alumina ceramics or aluminum nitride ceramics as the main material, but at the same time, other conductive substances need to be added to make its overall resistivity meet the functional requirements. It is necessary to have a good understanding of the thermal conductivity, wear resistance and hardness of the ceramic material in order to obtain the basic raw materials that meet the technical indicators of semiconductor manufacturing; secondly, the internal machining structure of the ceramic requires high precision, and the combination of the ceramic layer and the metal base must meet the uniformity and High-strength requirements, so the structural design and processing of the electrostatic chuck requires skills and knowledge in precision machining; and the surface of the electrostatic chuck should reach a coating of about 0.01 microns after surface treatment, and at the same time, it must be resistant to high temperature, wear resistance and service life. More than three years, therefore, the requirements for the mastery and application of surface treatment technology are also relatively high. It can be seen that compound and cross-type technical talents are the basic guarantee for the semiconductor components industry.
c. The characteristics of fragmentation are obvious, and the international leading enterprises mainly focus on cross-industry and multi-product line development and M&A strategies.
Compared with the semiconductor equipment market, the semiconductor parts market is more subdivided, with obvious fragmentation characteristics. The market space for a single product is very small, and the technical threshold is high, so there are few pure semiconductor parts companies. Internationally leading semiconductor component companies usually focus on the development strategy of cross-industry and multi-product lines, and semiconductor components are often only one of the businesses of these large component manufacturers. For example, MKS Instrument Company occupies a major market share in product lines such as gas pressure gauges/reactors, RF/DC power supplies, vacuum products, and robotic arms. In addition to applications in the semiconductor industry, it is also widely used in industrial manufacturing, life and health sciences and other fields. Continuous mergers and acquisitions and integrations are also the main means used by the world’s leading semiconductor components companies to expand their scale. Following the acquisition of Edwards in 2014, it acquired another leader in the field of vacuum technology, German leybold (Leybold) in 2016, and established a separate vacuum technology department in 2017. In July 2019, Atlas acquired Brooks again (Brooks). ), the acquisition includes the cryopump operating company and Brooks’ 50% stake in Ulvac Cryogenics Ltd., further enhancing the global competitiveness of its vacuum business in the semiconductor field.
3
Semiconductor components market size and development pattern
(1) Scale and pattern of global semiconductor components market
The global semiconductor parts market mainly consists of two parts according to different service objects. One is the parts and related services custom-made or purchased by global semiconductor equipment manufacturers. According to data provided by VLSI, the sales volume of the subsystem market of semiconductor equipment in 2020 is close to US$10 billion, of which maintenance + support services account for 46%, component product sales account for 32% and replacement + upgrades account for 22%. The second is the parts and related services directly procured by global semiconductor manufacturers as consumables or spare parts.According to core data[2], In 2020, the purchase amount of front-end equipment parts for 8-inch and 12-inch wafer lines in mainland China exceeded 1 billion US dollars. my country’s manufacturing capacity accounts for about 12-15% of the world’s total. Considering the high value-added parts procurement demand brought by advanced technology, the global procurement of front-end equipment parts for 8-inch and 12-inch wafer lines is at least US$10 billion above. Therefore, by superimposing two parts of the semiconductor parts sales market, it can be seen that the global semiconductor parts market is 20 billion to 25 billion US dollars or even larger.
Although the overall size of the semiconductor component market is only less than 5% of the global semiconductor market size of nearly 500 billion US dollars, the value of components is usually dozens of times their own prices, and they have strong industrial radiation capabilities and influence. In addition, the key technology of semiconductor components reflects the technological level of a country’s industry and semiconductor equipment, and has a very important strategic position. Its technological progress is a prerequisite for technological innovation affecting the downstream digital economy and information application industries.
According to VLSI data[3]among the top 10 leading suppliers of semiconductor components in the world in 2020 (see Table 2-1), including Zeiss ZEISS (optical lens), MKS instruments (MFC, RF power supply, vacuum products), Edwards (vacuum pump), Advanced Energy (RF power supply), Horiba (MFC), VAT (Vacuum Valves), Ichor (Modular Gas Delivery System and other components), Ultra Clean Tech (Sealing System), ASML (Optics) and EBARA (Dry Pumps).
Table 2-1. Ranking of the top ten semiconductor component manufacturers in the world
(Data sources: annual reports of each company, collation of network information)
According to the VLSI data in Figure 2-1, in the past 10 years, the total market share of the top ten suppliers has tended to stabilize at around 50%. However, due to the strict requirements on precision and quality of semiconductor components, as far as a single semiconductor component is concerned, there are only a few suppliers in the world that can provide products, which also leads to the fact that although the industry concentration of semiconductor components is only 50% However, the concentration of sub-categories is often above 80%-90%, and the monopoly effect is relatively obvious. For example, in the field of electrostatic chucks, American and Japanese semiconductor companies are basically dominated (see Table 2-2), with a market share of more than 95%, mainly including American AMAT (Applied Materials), American LAM (Fanlin Group), and Japanese company Shinko (Shinko Electric), TOTO, NTK, etc.
Figure 2-1. The market share of the world’s top ten semiconductor component manufacturers is stable at around 50% (Data source: VLSI)
Table 2-2. List of global leading companies of major parts and components
(Data source: Jiangfeng Electronics, network information collation)
(2) Scale and pattern of my country’s semiconductor components market
At present, my country’s semiconductor parts industry is still in its infancy, and the overall scale is small.According to core data[2], In 2020, China’s local wafer manufacturers (mainly including SMIC, Hua Hong Group, China Resources Microelectronics, Yangtze River Storage, etc.) purchased 8-inch and 12-inch front-end equipment parts for about US$430 million. However, due to the rapid expansion of domestic wafer manufacturing capacity in my country, it is expected that the demand for semiconductor components will continue to be strong. According to the existing domestic wafer manufacturing capacity plan, there will be 50% new capacity by 2023. According to the purchase demand of equipment and production lines at the same time, it is estimated that the domestic semiconductor components market will exceed 8 billion yuan in 2023, and is expected to exceed 12 billion yuan by 2025.
Despite the rapid growth of the domestic semiconductor component market, the technical capabilities, process levels, product accuracy and reliability of my country’s local component companies are far from meeting the needs of domestic equipment and wafer manufacturers, and the overall localization rate is still relatively high. low level. Generally speaking, for precision machined parts produced by customized design, the localization rate in my country is relatively high. Because domestic semiconductor equipment is in its infancy, in order to achieve mass production as soon as possible to catch up with the advanced level, it often adopts the model of self-designed, and then processed by foreign (mainly Japan, a small amount of South Korea) processors. Due to the special requirements of raw materials, processing methods, surface treatment methods and cleaning and packaging for precision machining parts of semiconductor equipment, domestic processors could not meet them for a while, and also because Japanese processing technology suppliers have relatively rich experience in processing parts of the same type. Some design mistakes can be found and adjusted during processing. Later, with the gradual expansion of the domestic market, a small number of domestic semiconductor equipment manufacturers, in order to reduce costs and ensure the security of the supply chain, began to gradually cultivate domestic processors from other industries and began to devote themselves to the processing of precision parts of semiconductor equipment. Therefore, in the field of precision machining parts dominated by equipment manufacturers, domestic parts manufacturers have made rapid progress. However, for general-purpose purchased parts that are more standardized and highly dependent on market competition, the localization rate is generally very low. The main reason is that the design and production requirements of these general-purpose purchased parts are very high. Even if the samples of domestic products can reach the same level, they still need to work hard to ensure the stability of mass production.At the same time, because domestic equipment companies have just made progress in localization, they are still relatively passive in the procurement of general-purpose components, mainly domestic mature products, and are reluctant to try new domestically manufactured products.[1].
The above are the main reasons why my country is still unable to achieve “self-controllable” in the core products of semiconductor components. According to the data of domestic mainstream foundries, there are more than 2,000 types of parts (including maintenance replacement and failure replacement parts) used in daily operations throughout the year, but the domestic market share is only about 8%. The US and Japan share 59.7% and 26.7% respectively. In fact, the high-end parts market is mainly occupied by suppliers from the United States, Japan and Europe; the mid- and low-end parts market is mainly occupied by suppliers from South Korea and Taiwan. The electrostatic chuck is a key non-consumable component of a wafer manufacturing plant, and the unit price is as high as tens of thousands or even hundreds of thousands of dollars. At present, there is no domestic company that can make relevant mature products, even the aluminum nitride ceramic raw materials used in electrostatic chucks. Far from meeting the required technical indicators, the external dependence is over 99%. In addition, although the scale of my country’s vacuum pump industry has approached 200 billion yuan, high-end products from Edwards and other companies still need to be imported in terms of semiconductor dry vacuum pumps. However, in recent years, with the acceleration of new production capacity and expansion of the domestic semiconductor industry, the superposition of the new crown epidemic has caused the obstruction of logistics and transportation services, resulting in continuous delays in the delivery of foreign parts and components, which has brought accelerated progress to some domestic semiconductor parts companies with high growth potential in China Opportunities for domestic substitution. For example, the ShowerHead and cavity processing business of Jiangfeng Electronics, the filter business of Cobaite, and the dry vacuum pump business of Tongjia Hongrui. Table 2-3 summarizes some Chinese companies in different semiconductor components fields.
Table 2-3. Major domestic semiconductor parts companies
(Data source: network information collation)
4
The main problems faced by the localization of semiconductor components
(1) Lack of attention to parts and components, and industrial support policies are out of place
The total scale of the semiconductor component industry is in the billions. Compared with the core semiconductor industry chain, the volume is small, the product variety and specifications are various, the number of leading enterprises is small, the industrial concentration is low, and the existing technical problems are scattered. Therefore, for a long time not getting enough attention.Since 2014, my country has promoted the development of the semiconductor industry to a national strategy, and subsequently at least 30 local governments have issued support policies to promote the development of the semiconductor industry.[9]However, whether at the national level or at the local level, policies focus more on design, manufacturing, packaging and testing, equipment and materials, and rarely cover the semiconductor component industry. In terms of capital, parts and components companies rarely get the favor of capital. The National Integrated Circuit Industry Investment Fund currently invests a relatively small proportion in the field of semiconductor components, and the investment amount is less than 100 million yuan. By the end of 2020, the total market value (less than 30 billion yuan) of listed companies with semiconductor components as their main business accounted for only 1% of the total market value of all semiconductor industry chain companies (more than 3 trillion yuan).
(2) The innovation capability is relatively backward, and the core technology gap is obvious
Because the parts industry has not received attention for a long time, it can only grow extensively. Therefore, most domestic parts companies enter the semiconductor industry mainly to provide maintenance and replacement services and cleaning services. The overall R&D investment is not enough, and the innovation ability is relatively backward. For a long time staying at the low-end production standard and copying the level of foreign products, the core technology gap is obvious. According to the prospectus of a domestic semiconductor component listed company, there are only 15 R&D personnel, and the total R&D investment from 2016 to 2018 is less than 20 million yuan, and the average annual R&D investment intensity is less than 5%. In addition, the lack of innovation capability of my country’s semiconductor parts industry is also reflected in the imperfect industry standard system, serious lack of investment in basic process research, poor access to process technology, and the lack of close integration of scientific research and production practice, which restricts semiconductor parts products. Innovative development of structural design technology, reliability technology, manufacturing process and process, and basic material performance research.
Table 2-4. Technical difficulties of major domestic semiconductor components
(Data source: SMIC[4]Jiangfeng Electronics[6]network information organization)
(3) Insufficient supply of craftsman talents and lack of effective incentive mechanism
At present, the talent gap in my country’s semiconductor industry has reached hundreds of thousands of people. Although my country has introduced a series of support measures in semiconductor talent training in recent years, a large number of semiconductor talent training mainly focuses on design, manufacturing, equipment and materials. There is still a lack of attention to talent training in basic industries such as basic disciplines. There is a lack of overall planning and implementation in the education system reform of basic disciplines, professional setting, on-the-job engineering education, and technical qualification certification. There is also a lack of guidance for the craftsman spirit who advocates refinement, truth-seeking, innovation, and is proficient in design and tackling tough problems.[5]. In addition, the semiconductor components industry faces serious problems of insufficient talent incentive mechanism. Although the overall salary level of personnel in the domestic semiconductor industry has been greatly improved compared with before, for the machining, precision instrumentation, surface treatment and other industries required by component companies, the salary of employees is generally much lower than the average level of the semiconductor industry. According to the prospectus of a domestic semiconductor component company, there were only 15 R&D personnel before its listing, the annual salary of core technicians was only 75,000, and the annual salary of ordinary R&D personnel was only 30,000. The low salary level has led to a serious brain drain in semiconductor parts companies, resulting in a lack of successors in the basic parts industry and falling into a vicious circle.
(4) The links of the industrial chain are out of touch, and the upstream support capacity is insufficient
Before semiconductor components are verified on large-scale production lines and sold on a large scale, they need to go through strict and complex verification procedures. Therefore, component manufacturers need to have full cooperation with downstream equipment and manufacturers. At present, the domestic semiconductor component online verification process is complicated and the process is long. The cooperation between manufacturers, equipment manufacturers and domestic semiconductor component manufacturers is not high, and there is a lack of effective communication and interaction. Domestic substitution power is insufficient. In addition, in the long-term product iteration process, existing foreign component manufacturers have formed a large number of Know-How (technical know-how).However, in the follow-up imitation and trial production process, domestic manufacturers can only be similar in shape. Due to lack of experience and key technologies, they are eliminated in the initial verification and cannot enter large-scale applications.[5]. In addition, domestic semiconductor component manufacturers cannot obtain support from supporting links such as raw materials and production equipment, which also affects the competitiveness of their products. Semiconductor components are generally products with various varieties and high processing precision requirements. The raw materials and processing equipment for producing these components are demanding and expensive. As my country’s industry is influenced by the long-standing idea of ”focusing on the main engine and ignoring the supporting equipment”, the investment in the upstream and downstream supporting fields of parts and components is seriously insufficient, resulting in a gap between my country and foreign countries in the raw materials and production equipment of parts and components. For example, for the high-precision machining centers commonly used in semiconductor metal parts, my country lags behind foreign countries in terms of machining accuracy, machining stability, and geometric flexibility. Another example is aluminum alloy metal, tungsten and molybdenum metal, the raw materials for high-end metal parts manufacturing, and high-purity quartz sand raw materials for the upstream raw materials of quartz parts, which are basically monopolized by American and Japanese companies. limited to passive. Mainstream quartz glass materials (tube/rod/silo) basically come from companies in the United States, Germany, and Japan. The lack of upstream processing equipment and raw materials has led to the fact that most of my country’s semiconductor parts companies have been operating at a low-tech level for a long time. The level of raw materials and process equipment is not high, and the advanced equipment is lacking and not supporting. It cannot guarantee the consistency of product quality, affecting the Product quality improvement.
(5) Some manufacturing conditions are limited, which affects the upgrade to high-end
Since the semiconductor manufacturing process is often in a high temperature and highly corrosive environment, more than half of the semiconductor components need to be surface treated to improve their corrosion resistance. For example, the plasma etching chamber of semiconductor etching equipment is in a high-density, high-corrosion, high-activity plasma environment, and the chamber and its components are easily corroded by plasma. In order to prolong the service life of these components, it is often used in Anodizing the surface of aluminum-based materials (aluminum and aluminum alloys) can effectively reduce the corrosion of the chamber and other aluminum-based materials by plasma. The increasingly strict environmental protection requirements in my country have led to the controlled development of most surface treatment technologies such as sandblasting, thermal spraying, electroplating, and anodizing, which has led to some high-end surface treatment processes, such as micro-arc oxidation, high-end spraying, and Y2O3 ceramic coating. There is always a big gap in China, which also directly affects the performance and quality of parts and components. Valve parts, gas sprinkler head Showerhead, ceramic parts Ceramic and other parts, although Chinese manufacturers can make shapes according to the drawings, but because they cannot solve Material and surface treatment issues, development is constrained by the foundation.In addition, some cutting-edge technologies of semiconductor components are limited by the “embargo”. Domestic companies lack drawings and precision data, so they cannot evolve to mid-to-high-end technologies. For example, the low-voltage vacuum gauges produced by MKS in the United States have always required Apply for an export license to purchase[6].
5
Suggestions on the Development of Semiconductor Parts Industry in my country
(1) Attach importance to top-level design and guide industry development
The field of semiconductor components is a key “stuck neck” link that has long relied heavily on advanced countries such as the United States and Japan, and needs to pay more attention to top-level design. It is recommended to formulate a special plan, plan or roadmap for the development of the semiconductor components industry, determine the long-term strategic framework for the development of the industry, and formulate appropriate policies and plans according to the development status at home and abroad in different periods to guide the development of the industry in an orderly manner. In particular, market capitalization attaches great importance to the semiconductor components industry.
(2) Set up industry special projects to stimulate innovation vitality
To achieve the rapid development and prosperity of the semiconductor parts industry, the most fundamental thing is to enhance the ability of independent innovation. At present, my country’s only imitation and tracking technology in the field of semiconductor parts has been unable to achieve a comprehensive guarantee of the semiconductor supply chain. Only Only through independent innovation can transcendence be achieved.Although some parts and components companies have been supported in the 02 special project[7], but it still needs to be further strengthened. It is recommended to set up a separate special project for the semiconductor parts industry in the national science and technology plan, and to unite with domestic leading enterprises of semiconductor parts, prepare to build a national-level parts technology innovation platform or research institute, gather superior forces to aim at breakthroughs and main directions of attack, adhere to independent innovation and research and development, and focus on Conquer a number of key core technologies of industrial basic parts, establish a technological innovation system with enterprises as the main body and a combination of production, education, and research, and guide the research and development of cutting-edge technologies, basic technologies, and key common technologies in the field of semiconductor components at the national level.
(3) Make up the policy gap and strengthen investment guidance
The semiconductor component industry is an industry with full market competition. The domestic component enterprises are small in scale, large in number, and thin in product profits. The research and development investment of new products and new technologies cannot be compared with that of international large enterprises, and it is difficult to win simply by market competition. However, under the current international geopolitical background, the government needs to implement relevant special policies to guide and support, and help domestic semiconductor parts companies to grow rapidly. It is suggested that the major products independently developed by domestic semiconductor parts companies should be subsidized and supported by the national finance and local finance, strengthen the protection of intellectual property rights of self-designed products, and include semiconductor parts and components in the government’s first set of procurement catalogs. Encourage various domestic industrial funds and socialized capital to actively invest in semiconductor parts companies, and help domestic semiconductor parts companies to develop through the capital market.
(4) Increase talent introduction and training and strengthen talent supply
Comprehensively strengthen the training and introduction of engineering, scientific research, and compound talents in the fields of semiconductor components[8]. Encourage large-scale scientific research institutions to establish postgraduate education and post-doctoral workstations in the direction of semiconductor components, and rely on major national engineering projects and major scientific and technological projects to cultivate leading talents in semiconductor component engineering technology. Advocate enterprises, schools and scientific research institutions to jointly carry out vocational education and on-the-job training, and actively promote the model of school-enterprise cooperation to jointly cultivate skilled talents. Parts of skilled personnel, strengthen the supply of talents. Adopt various methods to actively introduce overseas engineering and technology leaders and talents in short supply, encourage local governments to issue talent policies for core technical backbones and leading entrepreneurs in the field of semiconductor components, and continuously improve the talent incentive mechanism to stimulate the vitality of industrial development.
(5) Promote the linkage of mechanical parts to ensure independent supply
Promote the “mechanical linkage” of the basic semiconductor supply chain, completely reverse the disconnection between parts and components, equipment and manufacturing, and encourage domestic fabs and equipment factories to effectively play the role of large-scale production line organization and coordination through government guidance to collaborate with local parts and components Manufacturers strengthen the cooperation of the industrial chain through various methods such as unveiling the list, horse racing, and targeted research to achieve the coordinated development of the host and basic components. Support semiconductor manufacturing or equipment engineering projects led by the state or local governments, give priority to domestic semiconductor component product verification opportunities, and give certain risk subsidies. Encourage equipment component manufacturers in the fields of machinery, electronics, and chemical industry to actively expand and expand their semiconductor business, develop higher-end products to meet the needs of semiconductor equipment based on their own technical foundation, further consolidate and improve product layout, and enhance the independence of domestic components Supply capacity.
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