On October 28, 2020, the “2020 China International Integrated Circuit Industry Innovation and Development Summit Forum” hosted by OFweek Weiken and organized by OFweek Electronic Engineering Network will be held in the Peony Hall on the 5th floor of Shenzhen Convention and Exhibition Center (Futian).
With the theme of “chip era, chip journey”, the conference invites top experts, scholars and executives of famous enterprises as important guests of this conference, aiming at the development policies of the integrated circuit industry, market trends, terminal applications, upstream and downstream collaborative innovation, and industrial chain. The key technologies and other aspects of the splendid theme sharing and the latest research show, combined with the hot topics of the era such as artificial intelligence, Internet of Things, 5G, etc., to convey new thinking to the world, and stimulate unprecedented new kinetic energy for the industry.
He Jin, Director of Peking University Shenzhen Key Laboratory of Chips and Professor of Peking University: A new direction for chip research and development to accelerate the implementation of the 5G era
From the Internet to the mobile Internet, to the Internet of Things, and finally to the Internet of Things, the Internet and the mobile Internet in the past 20 years are the ‘Internet of People’, and the next 20 years will be a new era of ‘Intelligent Internet of Things’. It is a golden new era of innovative applications of AloT and blockchain based on 5G.
He Jin, director of the Shenzhen Key Laboratory of Chips at Peking University and a professor at Peking University, believes that the development of 5G, AIoT and blockchain technology accelerates the transition from the ‘Internet of Things’ to the era of ‘smart IoT’, and the ‘smart IoT’ will bring IoT devices to the forefront. Enter the era of smart devices characterized by perception, understanding and self-learning. In the era of intelligence, everything has a core, the world has wisdom, and the global blockchain requires breakthroughs in new chip technology based on software and hardware co-design.
The rapid development of technology has also brought huge breakthrough needs and space to the development of the chip industry. Power consumption, bandwidth, speed, and cost have all become key points in the chip research and development process. In order to solve the problem of chip research and development in the 5G era and find the development trend of the chip field, on October 28, Professor He Jin will give the audience a keynote speech on “The New Direction of Chip Research and Development to Accelerate the Landing of the 5G Era”, covering from 5G, computing, chip Cut in from an equal angle, and deeply analyze the way of chip research and development in the 5G era.
Dr. He Jin, former researcher of the EECS Department of the University of California, Berkeley, USA, returned to China in 2005 and served as a professor at Peking University. Since 2010, he has also served as the director of the Shenzhen Key Laboratory of Chips at Peking University. Since 2019, he has also served as the deputy director of the Bay Area Institute of Digital Economy and Technology. He was a visiting professor at Hong Kong University of Science and Technology, a part-time researcher at the Chinese Academy of Sciences, and a visiting professor at Hiroshima University. Director and co-chairman of Shenzhen 5G Industry Alliance Expert Committee, co-chairman of Shenzhen-Hong Kong-Macao Doctoral Experts Alliance, independent director of China Microelectronics (listed company), and chief scientist of Wenxian Microelectronics.
Professor He Jin’s main research field is micro-nano chip technology and design technology. As the main developer of the semiconductor chip EDA international integrated circuit industry standard CMOS model BSIM4.3.0, his research results have been widely adopted, which has accelerated the international community’s entry into nanometer and deep nanometer. Chip Era; Professor He Jin, as one of the main developers of the international integrated circuit industry standard BSIM-FinFET, his research results have been adopted by the international high-end smartphone chip design, greatly improving the quality of life in the information society and profoundly reshaping the development path of the chip industry .
In addition, this forum also invited Pan Yuejun, Marketing Director of ON Semiconductor, Tang Zhao, Product and Application Marketing Manager of TI (Texas Instruments), Bai Yawei, ST Strategy Marketing Manager, and Wang Qian, Technical Support Expert of Renesas Electronics (China) Co., Ltd. And many other famous enterprise executives, they will give wonderful speeches on sensor technology, advanced manufacturing process, Internet of Things communication technology and so on.
The specific agenda is as follows
Concurrent activities
At that time, in addition to the “2020 China International Integrated Circuit Industry Innovation and Development Summit Forum”, the “2020 China (Shenzhen) Industrial Internet Industry Development Summit Forum”, “OFweek 2020 (Fifth) Internet of Things Industry Upgrade Forum”, ” OFweek2020 (5th) Artificial Intelligence Technology Innovation Forum”, “2020 China (Shenzhen) Big Data & Cloud Computing Technology and Application Summit Forum” and many other forums and activities.
Here, we sincerely invite you to participate in this industry event to share industry innovation and discuss development opportunities!
On October 28, 2020, the “2020 China International Integrated Circuit Industry Innovation and Development Summit Forum” hosted by OFweek Weiken and organized by OFweek Electronic Engineering Network will be held in the Peony Hall on the 5th floor of Shenzhen Convention and Exhibition Center (Futian).
With the theme of “chip era, chip journey”, the conference invites top experts, scholars and executives of famous enterprises as important guests of this conference, aiming at the development policies of the integrated circuit industry, market trends, terminal applications, upstream and downstream collaborative innovation, and industrial chain. The key technologies and other aspects of the splendid theme sharing and the latest research show, combined with the hot topics of the era such as artificial intelligence, Internet of Things, 5G, etc., to convey new thinking to the world, and stimulate unprecedented new kinetic energy for the industry.
He Jin, Director of Peking University Shenzhen Key Laboratory of Chips and Professor of Peking University: A new direction for chip research and development to accelerate the implementation of the 5G era
From the Internet to the mobile Internet, to the Internet of Things, and finally to the Internet of Things, the Internet and the mobile Internet in the past 20 years are the ‘Internet of People’, and the next 20 years will be a new era of ‘Intelligent Internet of Things’. It is a golden new era of innovative applications of AloT and blockchain based on 5G.
He Jin, director of the Shenzhen Key Laboratory of Chips at Peking University and a professor at Peking University, believes that the development of 5G, AIoT and blockchain technology accelerates the transition from the ‘Internet of Things’ to the era of ‘smart IoT’, and the ‘smart IoT’ will bring IoT devices to the forefront. Enter the era of smart devices characterized by perception, understanding and self-learning. In the era of intelligence, everything has a core, the world has wisdom, and the global blockchain requires breakthroughs in new chip technology based on software and hardware co-design.
The rapid development of technology has also brought huge breakthrough needs and space to the development of the chip industry. Power consumption, bandwidth, speed, and cost have all become key points in the chip research and development process. In order to solve the problem of chip research and development in the 5G era and find the development trend of the chip field, on October 28, Professor He Jin will give the audience a keynote speech on “The New Direction of Chip Research and Development to Accelerate the Landing of the 5G Era”, covering from 5G, computing, chip Cut in from an equal angle, and deeply analyze the way of chip research and development in the 5G era.
Dr. He Jin, former researcher of the EECS Department of the University of California, Berkeley, USA, returned to China in 2005 and served as a professor at Peking University. Since 2010, he has also served as the director of the Shenzhen Key Laboratory of Chips at Peking University. Since 2019, he has also served as the deputy director of the Bay Area Institute of Digital Economy and Technology. He was a visiting professor at Hong Kong University of Science and Technology, a part-time researcher at the Chinese Academy of Sciences, and a visiting professor at Hiroshima University. Director and co-chairman of Shenzhen 5G Industry Alliance Expert Committee, co-chairman of Shenzhen-Hong Kong-Macao Doctoral Experts Alliance, independent director of China Microelectronics (listed company), and chief scientist of Wenxian Microelectronics.
Professor He Jin’s main research field is micro-nano chip technology and design technology. As the main developer of the semiconductor chip EDA international integrated circuit industry standard CMOS model BSIM4.3.0, his research results have been widely adopted, which has accelerated the international community’s entry into nanometer and deep nanometer. Chip Era; Professor He Jin, as one of the main developers of the international integrated circuit industry standard BSIM-FinFET, his research results have been adopted by the international high-end smartphone chip design, greatly improving the quality of life in the information society and profoundly reshaping the development path of the chip industry .
In addition, this forum also invited Pan Yuejun, Marketing Director of ON Semiconductor, Tang Zhao, Product and Application Marketing Manager of TI (Texas Instruments), Bai Yawei, ST Strategy Marketing Manager, and Wang Qian, Technical Support Expert of Renesas Electronics (China) Co., Ltd. And many other famous enterprise executives, they will give wonderful speeches on sensor technology, advanced manufacturing process, Internet of Things communication technology and so on.
The specific agenda is as follows
Concurrent activities
At that time, in addition to the “2020 China International Integrated Circuit Industry Innovation and Development Summit Forum”, the “2020 China (Shenzhen) Industrial Internet Industry Development Summit Forum”, “OFweek 2020 (Fifth) Internet of Things Industry Upgrade Forum”, ” OFweek2020 (5th) Artificial Intelligence Technology Innovation Forum”, “2020 China (Shenzhen) Big Data & Cloud Computing Technology and Application Summit Forum” and many other forums and activities.
Here, we sincerely invite you to participate in this industry event to share industry innovation and discuss development opportunities!
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