Recently, ASML, the “one brother of lithography machine”, has released a new product: the first-generation HMI multi-beam inspection machine HMI eScan1000, which is suitable for 5nm and more advanced processes that will be mass-produced in 2020, which can increase the production capacity of manufacturers. Soaring about 600%.
In the process of wafer manufacturing, in addition to the excellent manufacturing process level, quality inspection is equally important. The newly launched HMI eScan1000 by ASML is actually a high-tech monitoring system based on HMI multi-beam technology, which is specially designed to inspect the wafer quality. Its accuracy and throughput directly affect the final production efficiency. The HMI eScan1000 can generate and control nine electron beams simultaneously, greatly reducing the time and cost of wafer quality analysis and increasing throughput by up to 600% compared to a single electron beam inspection tool.
The new MBI system includes an electron optics system capable of creating and steering multiple primary electron beams, then collecting and processing the resulting secondary electron beams, limiting crosstalk between beams to less than 2% and providing consistent imaging quality. It also features a high-speed stage that increases the overall throughput of the system and a high-speed computing architecture that processes data streams from multiple beams in real time.
The biggest highlight of the new wafer inspection system is that it can increase the production capacity of manufacturers by about 600%. What is the concept?
For example, TSMC is the first to mass-produce the 5nm process, and the production capacity in the first half of the year will reach 10,000 wafers per month. Although it was affected by the epidemic in the early stage, it is expected that the peak period of shipments will be in the Q3 quarter, and the production capacity will be increased to 7-8. Ten thousand wafers per month, mainly for Apple and HiSilicon.
Affected by the news of Huawei’s urgent additional chip orders recently, there are related news that TSMC may consider transferring orders from other customers to Huawei. Now the orders are fully loaded, if the production capacity can be increased by 600%, it will not only solve Huawei’s urgent needs, but also avoid the A series of problems brought about by the move order.
Of course, the 600% increase in production capacity is only a theoretical data. Before the wafer inspection is completed, there are many processes such as purification, coating, and ion main camera. Each link will affect the final production capacity efficiency.
The Importance of Wafer Inspection
For a long time, lithography machine manufacturers have been working hard to develop advanced wafer inspection systems to find defects in advanced Chips. As the wafer area increases and the density increases, the cost of wafer testing is getting higher and higher. Chips require longer test times and more sophisticated power supplies, mechanics, and computer systems to perform tests and monitor test results.
At present, ASML’s HMI eScan1000 inspection system has been delivered to customers for qualification. ASML plans to increase the number of beams and beam resolution to meet the product roadmap requirements of future generations of chip manufacturers.
Recently, ASML, the “one brother of lithography machine”, has released a new product: the first-generation HMI multi-beam inspection machine HMI eScan1000, which is suitable for 5nm and more advanced processes that will be mass-produced in 2020, which can increase the production capacity of manufacturers. Soaring about 600%.
In the process of wafer manufacturing, in addition to the excellent manufacturing process level, quality inspection is equally important. The newly launched HMI eScan1000 by ASML is actually a high-tech monitoring system based on HMI multi-beam technology, which is specially designed to inspect the wafer quality. Its accuracy and throughput directly affect the final production efficiency. The HMI eScan1000 can generate and control nine electron beams simultaneously, greatly reducing the time and cost of wafer quality analysis and increasing throughput by up to 600% compared to a single electron beam inspection tool.
The new MBI system includes an electron optics system capable of creating and steering multiple primary electron beams, then collecting and processing the resulting secondary electron beams, limiting crosstalk between beams to less than 2% and providing consistent imaging quality. It also features a high-speed stage that increases the overall throughput of the system and a high-speed computing architecture that processes data streams from multiple beams in real time.
The biggest highlight of the new wafer inspection system is that it can increase the production capacity of manufacturers by about 600%. What is the concept?
For example, TSMC is the first to mass-produce the 5nm process, and the production capacity in the first half of the year will reach 10,000 wafers per month. Although it was affected by the epidemic in the early stage, it is expected that the peak period of shipments will be in the Q3 quarter, and the production capacity will be increased to 7-8. Ten thousand wafers per month, mainly for Apple and HiSilicon.
Affected by the news of Huawei’s urgent additional chip orders recently, there are related news that TSMC may consider transferring orders from other customers to Huawei. Now the orders are fully loaded, if the production capacity can be increased by 600%, it will not only solve Huawei’s urgent needs, but also avoid the A series of problems brought about by the move order.
Of course, the 600% increase in production capacity is only a theoretical data. Before the wafer inspection is completed, there are many processes such as purification, coating, and ion main camera. Each link will affect the final production capacity efficiency.
The Importance of Wafer Inspection
For a long time, lithography machine manufacturers have been working hard to develop advanced wafer inspection systems to find defects in advanced chips. As the wafer area increases and the density increases, the cost of wafer testing is getting higher and higher. Chips require longer test times and more sophisticated power supplies, mechanics, and computer systems to perform tests and monitor test results.
At present, ASML’s HMI eScan1000 inspection system has been delivered to customers for qualification. ASML plans to increase the number of beams and beam resolution to meet the product roadmap requirements of future generations of chip manufacturers.
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